EVONIK SILANES

Ethyl polysilicate hybrid binder – Dynasylan SILBOND HT-30 is a milky-white, low-viscosity pre-hydrolyzed ethyl polysilicate hybrid binder that contains a mixture of silica derived from TEOS and other components. The silica content ranges from 29.5% to 31.0% (as SiO2).

Ethyl polysilicate hybrid binder – Dynasylan SILBOND HT-33 is a milky-white, low-viscosity pre-hydrolyzed ethyl polysilicate hybrid binder that contains a mixture of silica derived from TEOS and other components. The silica content ranges from 32.7% to 34.0% (as SiO2).

High-purity, low-boron tetraethyl orthosilicate – Dynasylan SILBOND LBEG (low-boron electronic grade) is a clear, very high-purity (99.86%), low-boron ethyl silicate product targeted for use in the electronics industry. Dynasylan SILBOND LBEG is tetraethyl orthosilicate (TEOS), and is an excellent source of silica for sol-gel processes, spin-on glass, electronics, and other applications that require high purity.

Tetraethyl orthosilicate 99.0% – Dynasylan SILBOND Pure is a clear, low-viscosity liquid that is essentially pure tetraethyl orthosilicate monomer (99.0%).

Ultra high-purity tetraethyl orthosilicate – Dynasylan SILBOND UHPT (ultra high-purity TEOS) is a clear, very high-purity (99.990%), low-boron ethyl silicate product targeted for use in the semiconductor industry. Dynasylan SILBOND UHPT is tetraethyl orthosilicate (TEOS).