PARKER LORD

Chemlok 234X (NW) adhesive is a general purpose covercoat adhesive designed for use over Chemlok 205 primer to bond a wide variety of vulcanized or unvulcanized rubber compounds to metal or other rigid substrates. It is composed of a mixture of polymers, organic compounds, and mineral fillers dissolved or dispersed in an organic solvent system.

LORD Chemlok 236A adhesive is a general purpose covercoat adhesive designed for use over Chemlok 205 primer. This adhesive system will bond a wide variety of vulcanized or unvulcanized rubber compounds to primed metal or other rigid substrates. It is composed of a mixture of polymers, organic compounds, and mineral fillers dissolved or dispersed in an organic solvent system. Chemlok 236A adhesive is particularly useful in bonding compounds based on butyl and EPDM. It will also bond most compounds based on natural rubber (NR), polyisoprene (IR), styrene-butadiene (SBR), polybutadiene (BR), polychloroprene (CR), and nitrile (NBR) polymers.

LORD Chemlok 236X adhesive is a covercoat adhesive designed for use over Chemlok 205 primer. This adhesive system will bond uncured butyl, EPDM, SBR, and natural rubber compounds to primed metal parts. It is composed of a mixture of polymers, organic compounds, and mineral fillers dissolved or dispersed in an organic solvent system.

LORD Chemlok 238 (NW) adhesive is a covercoat adhesive used to bond a variety of non-polar elastomers to themselves or to Chemlok 205 primed metals and other rigid substrates. It is composed of a mixture of polymers, organic compounds, and mineral fillers dissolved or dispersed in an organic solvent system. Chemlok 238 (NW) adhesive will bond compounds based on butyl and EPDM. It will also bond most compounds based on natural rubber (NR), polyisoprene (IR), styrene-butadiene (SBR), polybutadiene (BR), polychloroprene (CR), and nitrile (NBR) polymers.

LORD Chemlok 238 adhesive is a covercoat adhesive used to bond a variety of non-polar elastomers to themselves or to Chemlok 205 primed metals and other rigid substrates. It is composed of a mixture of polymers, organic compounds, and mineral fillers dissolved or dispersed in an organic solvent system. Chemlok 238 adhesive will bond compounds based on butyl and EPDM. It will also bond most compounds based on natural rubber (NR), polyisoprene (IR), styrene-butadiene (SBR), polybutadiene (BR), polychloroprene (CR), and nitrile (NBR) polymers.