MAGRIS TALC

JetFil T490 is an off-white, extremely platy talc product used for enhancing stiffness, HDT, and dimensional stability in general purpose plastics applications, including in sheet and thermoformed plastics. JetFil T490 is recommended for thermoplastic applications, including in rigid packaging and appliance applications to maximize reinforcement at talc loadings as high as 20% to 40%. It could also allow achieving good long-term thermal stability (heat aging).

JetFil T590 is off-white, extremely platy, fine talc recommended for improving stiffness, HDT, and dimensional stability in general purpose plastics applications including sheets and thermoformed plastics. JetFil T590 is used mainly in plastics applications, including rigid packaging and appliances, to maximize reinforcement at talc loadings as high as 20% to 40%. It could also allow achieving good long-term thermal stability (heat aging).

JetFil V390 is an extremely platy, coarse talc product that is beneficiated to maximize stiffness, HDT, and dimensional stability in plastics applications. The particle size distribution and top size of this product is engineered and controlled to provide maximum impact strength and the best balance of stiffness/impact resistance.

JetFil V575C is a high purity, extremely platy, fine talc product that is beneficiated to maximize stiffness, HDT, and dimensional stability in plastics applications. The particle size distribution and top size of this product is engineered and controlled to provide maximum impact strength and the best balance of stiffness/impact resistance. JetFil V575C is compacted to enhance compounding throughput and reduce dust generation.

JetFil V625C is an extremely platy, fine talc product that is beneficiated to maximize stiffness, HDT, and dimensional stability in plastics applications. The particle size distribution and top size of this product is engineered and controlled to provide maximum impact strength and the best balance of stiffness/impact resistance. JetFil V625C is compacted to enhance compounding throughput and reduce dust generation.