PARKER LORD

LORD Chemlok 6270 adhesive is a low mold-fouling, general purpose covercoat adhesive designed with improved prebake resistance for use over Chemlok primers. This adhesive system will bond a variety of unvulcanized rubber compounds to metal substrates. It is formulated without heavy metals and composed of a mixture of polymers, organic compounds, and mineral fillers dissolved or dispersed in a xylene solvent system. This adhesive system will bond compounds based on natural rubber (NR), polyisoprene (IR), styrene-butadiene (SBR), polybutadiene (BR), polychloroprene (CR), nitrile (NBR), butyl (IIR) and EPDM polymers to metal. Chemlok primers, such as Chemlok 205, 207, 298, and 8009B primers, help to ensure environmental resistance of the bonded assembly and adhesion to the substrate.

LORD Chemlok 6411 adhesive is used to bond a variety of rubber compounds to metal and plastic substrates during vulcanization. It is formulated without heavy metals and composed of a mixture of polymers and heat-reactive components dissolved or dispersed in an organic solvent system. For general use, Chemlok 6411 adhesive should be used as a covercoat adhesive over Chemlok 205 or 207 primer. Chemlok 205 or 207 primer helps to ensure environmental resistance of the bonded assembly and adhesion to the substrate. In some applications, Chemlok 6411 adhesive may be used as a one-coat adhesive. This adhesive will bond compounds based on natural rubber (NR), polyisoprene (IR), styrene-butadiene (SBR), polybutadiene (BR), polychloroprene (CR), nitrile (NBR), butyl (IIR) and EPDM polymers to most metals, alloys, and rigid plastic substrates.

LORD Chemlok 6411LH adhesive is a low Hazardous Air Pollutant (HAP) covercoat adhesive designed for use over Chemlok 205LH or 207LH primer. This adhesive system is used to bond a variety of rubber compounds to metal and plastic substrates during vulcanization. It is formulated without heavy metals and composed of a mixture of polymers and heat-reactive components dissolved or dispersed in a low HAP organic solvent system. This adhesive system will bond compounds based on natural rubber (NR), polyisoprene (IR), styrene-butadiene (SBR), polybutadiene (BR), polychloroprene (CR), nitrile (NBR), butyl (IIR) and EPDM polymers to most metals, alloys, and rigid plastic substrates. Chemlok 205LH or 207LH primer helps to ensure environmental resistance of the bonded assembly and adhesion to the substrate.

LORD Chemlok 6450 adhesive can be used as a covercoat adhesive over Chemlok 207 primer or as a one-coat adhesive. This adhesive system will bond uncured rubber to metal substrates during the vulcanization of the elastomer.

LORD Chemlok 6451 adhesive can be used as a covercoat adhesive over Chemlok 207 primer or as a one-coat adhesive. This adhesive system will bond uncured rubber to metal substrates during the vulcanization of the elastomer.